Light, Humidity and Air Quality Sensors on RF Boards
Case Study: Design of an RF Board with Sensors | Sierra Circuits
That's it !
Tuesday, August 30, 2022
Monday, July 18, 2022
Reflow - Thermal Warpage
Replicating the Warpage characteristics of the Reflow Production Process
https://akrometrix.com/thermal-systems/?CID=mvbrief_IPC
That's !
Sunday, May 22, 2022
PCB Trace Width Calculator - Bittele
Bittele in Ontario Canada Offers Turn-Key PCB Services
PCB Trace Width Online Calculator IPC-2221
And there's a nice Table for minimum Trace and Space for heavy copper up to 3oz.
That's it !
Saturday, May 21, 2022
Reworking ICs with BGA and LGA Packages
Solder flows best where solder has gone before.
The key to successfully reworking BGA and LGA packages is tinning the pads on the PCB and IC with solder.
On the IC
Remove all oxidation using a trichlorofluoromethane cleaning solvent and an acid brush.
Apply and mildly active no clean flux to the IC's pads and bump each pad with a small amount of tin / lead solder.
Remove all no-clean flux residue using a trichlorofluoromethane cleaning solvent and acid brush.
On the PCB
Repeat the above process to apply a solder bump on the small pads of the PCB.
After the IC and PCB have been prepared as described above. . .
Brush a thin layer of no clean flux on the IC and PCB small pads. Do not apply flux to the thermal paddle.
Using a miniature syringe apply an appropriate amount of solder paste to the thermal pad on the PCB.
The solder paste should be 90% metal and 10% no-clean flux.
Precisely align the IC on the PCB.
Then use a hot air reflow machine with a bottom-side heater and a appropriate top-side hot nozzle.
The reflow process will likely require some practice on a sacrificial board.
That's it !
Wednesday, April 20, 2022
Saturday, April 2, 2022
ELECTRA - KONEKT
ELECTRA is a new generation of Shape-Based Autorouting software for PC boards.
That's it !
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