BGA - Rework and Reball

BGA and PCB Rework Services

Microelectronics packaging, device design and manufacturing - ISI

BGA Rework Stations & PCB Rework Services - Precision PCB Services

Circuit board rework and repair - BGA component rework and repair

That's it !

Efficiently Using BGA Signal Routing - NexLogic Technologies

BGAs - NexLogic Technologies:

'via Blog this'

Ultra-fine pitch devices pose new PCB design issues | Embedded

Ultra-fine pitch devices pose new PCB design issues | Embedded: 

"Ultra-fine pitch devices pose new PCB design issues Syed W. Ali, Nexlogic Technologies, Inc. SEPTEMBER 10, 2012

No Industry Specifications/Design Guidelines As indicated earlier, the electronics industry hasn’t yet developed the specifications nor the expertise to effectively perform 0.3mm ultra-fine pitch design and layout. 

This leaves many PCB layout engineers with few options other than to base their 0.3mm ultra-fine pitch on conventional 0.5mm pitch IPC design guidelines and layout rules."

'via Blog this'

Thermal Spokes (Reliefs)

Regarding the width of traces connecting to BGA Land Patterns - sysacom

By Denis Lachapelle

This article makes an interesting point regarding the trace widths for BGAs.

The suggested trace width considers thermal relief size traces to improve soldering yields for BGAs.

BGA Packages - Lattice Layout Recommendations

"As Ball Grid Array (BGA) packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout techniques. This document provides a brief overview of PCB layout considerations when working with BGA packages. It outlines some of the most common problems and provides tips for avoiding them at the design stage. A key challenge of adopting fine-pitch (0.8 mm or less) BGA packages is the design of a route fanout pattern that maximizes I/O utilization while minimizing fabrication cost. This technical note provides an overview of PCB design examples provided by Lattice Semiconductor."

Source Link:

'via Blog this'

METRIC PITCH BGA AND MICRO BGA ROUTING SOLUTIONS

METRIC PITCH BGA AND MICRO BGA ROUTING SOLUTIONS - Tom Hausherr

This white paper includes a Common Via Padstacks Table

'via Blog this'

BGA - Routing for MicroStar Junior

BGA - Routing for MicroStar Junior

 Recommended routing for VFBGA-48 and VFBGA-56

Also some geometric dimensioning and tolerancing (GD & T) terms.