Showing posts with label Thermal Reliefs. Show all posts
Showing posts with label Thermal Reliefs. Show all posts

Saturday, September 7, 2013

Thermal Spokes (Reliefs)


Regarding the width of traces connecting to BGA Land Patterns - sysacom

By Denis Lachapelle

This article makes an interesting point regarding the trace widths for BGAs.

The suggested trace width considers thermal relief size traces to improve soldering yields for BGAs.