Splitting Analog and Digital Ground - Don't Do it

See Rick Hartley and Robert Feranec - Splitting Analog and Digital Ground.

(100) Ground in PCB Layout - Separate or Not Separate? (with Rick Hartley) - YouTube

PLM Software - PDXpert

Simple, flexible product lifecycle management software for growing companies.

PDXpert PLM software: Simple & flexible product lifecycle management

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Mill-Max - SOLDER CUP CONNECTORS AND TERMINAL PINS

 

RF Design Reuse - Stackup Comments

For RF design reuse the 50 ohm trace width, distance to RF reference plane and PCB material need to be tightly constrained.

A well designed RF circuit can be moved to another PCB stackup provided the RF trace widths and dielectric thickness to the RF reference plane are nearly the same.  

RF matching work will be needed to optimize RF performance after changing stackups.

The Dielectric Constant (Dk or Er) is determined by the ratio of resin to glass.

The Dk of the material and distance to the reference plane determines the trace widths of the controlled impedances.

Dissipation Factor (Df or loss tangent). Low Df materials are preferred for RF performance.

Layer stackup considerations may include high-speed traces on outer layers which will require a thinner dielectric (~2.5mil) between L1 to L2.   A thicker dielectric (~3mil) can be used with a few impedance discontinuities and imperfections, i.e. trace width neck downs on the outer layers.

Vias in Pad Plated Over (VIPPO). RF designers appreciate VIPPO because it reduces the parasitics associated with vias and traces connected to RF components.

For fine pitch components in the design use thru-hole vias with a minimum size of 0.2mm / 0.45mm (drill / pads) or 8/18mil and very sparingly use 0.2mm / 0.4mm (8/16) where needed.

Use 10/22mil vias where possible.  Vias hole sizes should be 15mil or smaller to accommodate non-conductive fill and plated over vias ( VIPPO).

For high-speed designs consider using blind vias or back drilling a few thru-hole vias to reduce stub lengths. 

Blind vias may be less likely than thru-hole vias to experience via barrel fractures from repetitive thermal expansion in the Z axis,  Blind vias can also be useful where RF isolation is needed.

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LOCTITE STYCAST PC 40-UMF

Conformal coating is specifically formulated to rapidly gel and immobilize when exposed to UV light and then fully cure when exposed to atmospheric moisture, ensuring optimum performance even in shadowed areas. LOCTITE STYCAST PC 40-UMF conforms to IPC-CC-830 requirements.

LOCTITE STYCAST PC 40-UMF – Electronics - Henkel Adhesives

How to breakout a .5mm BGA - Sierra Circuits

 

Source: How to breakout a .5mm BGA - Sierra Circuits

Isola Core and Prepreg Data

Isola 370HR Core and Prepreg Data

www.isola-group.com › 370HR__Dk_Df_Tables

FR408HR Core and Prepreg Data

www.isola-group.com › FR408HR__Dk_Df_Tables

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