DPPM / FIT / MTBF Estimator - Texas Instruments

Source: Texas Instruments DPPM / FIT / MTBF Estimator

IPC Class 2 VS Class 3: The Different Design Rules

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Source: IPC Class 2 VS Class 3: The Different Design Rules | Sierra Circuits Blog

Randy's Comments:

IPC specs do not dictate the pad size. It's all about the finished minimum annular ring.

The IPC criteria is 2 mil finished annular ring on external layers and 1 mil minimum on the internal layers. Class 3 pad sizes > drill + 12mil are imposed by fabricators who have > 4 mil layer to layer tolerances.  

It comes down to fabricators capability and process tolerances.  Smaller pads can be used if the fabricator has tight layer to layer tolerances.  

Just be aware that tighter (smaller) tolerances will impact yields and the costs will be passed to the customer.

The other noteworthy Class 3 requirement for vias is the via barrel wall plating must have an average minimum thickness of 1 mil.  Stringent class 3 fab notes will specify an absolute minimum thickness for the barrel plating.

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Estimating Ground Bounce

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Source:
How to estimate ground bounce in a connector- Rule of Thumb #8 - EDN

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PCB Signal Integrity: Understand Coupling - YouTube

PCB Signal Integrity: Understand Coupling - YouTube:

Home - GigaTest Labs

Home - GigaTest Labs: "The Industry's leading Signal Integrity Company. Serving the Electronics Industry with Engineering Excellence."

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Using Remote Sensing - Vicor

Source:

Using Remote Sensing to Ensure Accurate Point of Load Voltage Control | VicorPowerBlog: 

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KwickFit - Fixed Size PCB Array Calculator

Fixed Size PCB Array Calculator:

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