IPC-2581 Consortium - Home

IPC-2581 Consortium - Home:

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The Perfect Stackup for High Speed Design

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http://www.icd.com.au/articles/Perfect_Stackup_PCB-Nov2011.pdf

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Microtek Laboratories | Testing and Training Resources

Microtek Laboratories | Testing and Training Resources:

Regarding PCB and PCA reliability.

Plated through hole integrity is the most important metric to monitor.   

Vias are small plated through holes used to connect signals passing from one layer to another layer.

90% of all bare board pcb failures (open and shorts) can be traced to bad vias.  That being said, reviewing cross sectioned samples of your boards prior to assembly is a critical to ensure long term reliability of your products.

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Wicking - Plated Through Holes

Related: CAF : Understanding Conductive Anodic Filament (CAF) on PCBs - ICAPE Group

FINISHED PCB REQUIREMENT

http://www.multiflexcircuits.com/documents/PCB_SPEC2.pdf

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PCBDESIGN007 Isola's I-Speed Endorsed as Laminate Choice for PCBs

"I-Speed has been endorsed by two leading companies as the laminate of choice for PCBs using sequential lamination technology, requiring high conductive anodic filament (CAF) reliability and improved, cost effective signal integrity."

Source:
PCBDESIGN007 Isola's I-Speed Endorsed as Laminate Choice for PCBs:

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CTE-Z - RoHs Thermal Stresses on VIAs

How To PCB - Thermal: Jack Olsen

Jack has an excellent description about CTE-Z and the thermal stresses RoHs reflow has on vias.  

Visit Jack Olsen's site 'How to PCB' to see the full article.

Click here to view the thermal stress animation.


The Z axis stresses can cause vias and traces to fracture.


See the link above to visit Jack's site and read the article.