PCB Mounting Holes « Tom Hausherr's Blog

PCB Mounting Holes « Tom Hausherr's Blog:

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Tutorials, How-to Guides

Documents, Tutorials, How-to Guides and Product Manuals for Mosaic's Single Board Computers, Embedded Device Servers, C Language Programming, and Microcontroller Boards:

Using Power MOSFETs to Limit Inrush Current (Soft Start).

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Toward A More Rational Silkscreen

Toward A More Rational Silkscreen:

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Paste Stencil - Area Ratio Calculator

Area Ratio Calculator: Beam On


















To achieve proper paste release from the stencil, an aperture's aspect ratio should be >1.5, and the area ratio should be >0.66. When the stencil separates from the board, paste release encounters a competing process; solder paste will either transfer to the pad on the board or stick to the aperture side walls. When the pad area is greater than 0.66 of the inside aperture wall area, a complete paste transfer should occur. Please see the below calculator which you can use to determine pad size for your aperture, and foil thickness of the stencil.

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Aperture Area Ratio, and Determining Stencil Thickness : Products and Services

Aperture Area Ratio, and Determining Stencil Thickness : Products and Services:

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IPC Standards Tree

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HDI (High Density Interconnect PCBs) - TTM Technologies, Inc.

"Advanced Capabilities: Microvias

A microvia maintains a laser drilled diameter of typically 0.006" (150µm), 0.005" (125µm), or 0.004" (100µm), which are optically aligned and require a pad diameter typically 0.012" (300µm), 0.010" (250µm), or 0.008" (200µm), allowing additional routing density. Microvias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper plated over the top or solid copper filled or plated. Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below.

Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used, however, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device, requires the use of Stacked MicroVias® using an inverted pyramid routing technique.

TTM maintains years of experience with HDI products and was a pioneer of second generation microvias or Stacked MicroVias (SMV®). SMV® Technology offers solid copper stacked microvias providing rout-out solutions for micro BGAs.

TTM developed and now offers an entire family of microvia technology solutions for your next generation products."

Source: HDI (High Density Interconnect PCBs) - TTM Technologies, Inc.:

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