Tuesday, April 30, 2013

Soldermask Design Basics - Standards, Materials and Processes | Epec Engineered Technologies

"By the way, don't assume that putting fingers of resist between pads on an otherwise bare board might help overcome bridging, because most bridging occurs between component leads above the board. You are just adding to the cost by using a more expensive process, and gaining little."

Source: Soldermask Design Basics - Standards, Materials and Processes | Epec Engineered Technologies:

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Tuesday, April 16, 2013

Paste Stencils - Circles Versus Squares

Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume

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