Saturday, November 26, 2022

Stiffeners & Busbars

 Formed Busbar Fabricator - Custom Copper Busbar Supplier | E-Fab, Inc.



Sunday, November 13, 2022

BGA SWITCH-A-PITCH ADAPTERS - ARIES

 BGA Switch-A-Pitch Adapters - ARIES Link

Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch 


That's it !

















Thursday, November 3, 2022

Educating the Customer

Here is a link to some good reading for PCB Stackup and Controlled Impedance.


That's it !

Monday, July 18, 2022

Sunday, May 22, 2022

PCB Trace Width Calculator - Bittele

Bittele in Ontario Canada Offers Turn-Key PCB Services

PCB Trace Width Online Calculator IPC-2221 


And there's a nice Table for minimum Trace and Space for heavy copper up to 3oz.


That's it !

Saturday, May 21, 2022

Reworking ICs with BGA and LGA Packages

Solder flows best where solder has gone before.

The key to successfully reworking BGA and LGA  packages is tinning the pads on the PCB and IC with solder.

On the IC

Remove all oxidation using a trichlorofluoromethane cleaning solvent and an acid brush.

Apply and mildly active no clean flux to the IC's pads and bump each pad with a small amount of tin / lead solder.  

Remove all no-clean flux residue using a trichlorofluoromethane cleaning solvent and acid brush.

On the PCB

Repeat the above process to apply a solder bump on the small pads of the PCB.

After the IC and PCB have been prepared as described above. . . 

Brush a thin layer of no clean flux on the IC  and PCB small pads. Do not apply flux to the thermal paddle.

Using a miniature syringe apply an appropriate amount of solder paste to the thermal pad on the PCB. 

The solder paste should be 90% metal and 10% no-clean flux.

Precisely align the IC on the PCB.

Then use a hot air reflow machine with a bottom-side heater and a appropriate top-side hot nozzle.

The reflow process will likely require some practice on a sacrificial board.  

A thermocouple monitored temperature profile should be developed and used to optimize yields and minimize thermal damage to the IC and PCB.

That's it !

Monday, March 28, 2022