To achieve proper paste release from the stencil, an aperture's aspect ratio should be >1.5, and the area ratio should be >0.66. When the stencil separates from the board, paste release encounters a competing process; solder paste will either transfer to the pad on the board or stick to the aperture side walls. When the pad area is greater than 0.66 of the inside aperture wall area, a complete paste transfer should occur. Please see the below calculator which you can use to determine pad size for your aperture, and foil thickness of the stencil.
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