PCB Designer

Saturday, September 7, 2013

Thermal Spokes (Reliefs)

Regarding the width of traces connecting to BGA Land Patterns - sysacom

By Denis Lachapelle

This article makes an interesting point regarding the trace widths for BGAs.

The suggested trace width considers thermal relief size traces to improve soldering yields for BGAs.

Visualize your PCB: fast and throughout the whole business process - Eurocircuits Printed circuits blog | Eurocircuits

"Visualize your PCB: fast and throughout the whole business process"

Visualize your PCB: fast and throughout the whole business process - Eurocircuits Printed circuits blog | Eurocircuits:

'via Blog this'

Soldermask on via-holes with ENIG finish.

Source: Soldermask on via-holes - Eurocircuits Printed circuits blog | Eurocircuits:

"For closed via-holes we have developed an alternative solution which avoids chemicals getting trapped in the partially closed via-holes during developing of the soldermask or during application of the Ni/Au.

Before the coating the entire panel with soldermask we selectively print soldermask into the via holes using a stencil. During a second print run we then cover the whole panel.

This way the via-holes are completely filled with soldermask. An even layer of soldermask now covers the via-holes leaving no pockets to hold residual chemicals.

We have used this technique for over 6 months, and it has proved successful in dramatically reducing the number of skip pad problems."

'via Blog this'

Via Plugging Methods - Pros and Cons

Plug Via Process Requirements - Circuit Board Manufacturing Solutions | Epec Engineered Technologies:

'via Blog this'

Soldering - Problems with Insufficient Barrel Fill

Problems with Insufficient Barrel Fill: - Circuit Net

"We are seeing insufficient barrel fill (60-75%) during lead free wave soldering. Can you point to some reasons why we may be seeing this insufficient condition and suggest a cure?

R. S"

'via Blog this'