Vias are critical to PCB functionality as the conduit for transferring signals between layers. Vias can remain open, tented over with soldermask or filled solid with either non-conductive or conductive material.
Conductively filled vias add capacity to the design, and using copper to fill the vias adds some benefits that other conductive material does not, including thermal and electrical conductivity. The high thermal conductivity of copper-filled vias provides an advantage in high heat applications and the added electrical conductivity provides superior current-carrying capability in high voltage applications.
ASC’s John Bushie takes us through the complex manufacturing process in this month’s video.
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