The Effect of Via Spacing on the Signal Integrity Performance of PCB with Slotted Ground
Via spacing on high-performance PCBs | EDN:
RELIABILITY TESTING FOR MICROVIAS IN PRINTED WIRE BOARDS
Proven microvia technology yields higher reliability because of the significantly lower area aspect ratio (1:1) due to its fabrication in one dielectric layer when compared to a larger drilled through-hole via having a much high aspect ratio (>10:1).
Source: http://nepp.nasa.gov/docuploads/136AC3F6-8535-4E65-A0AD21B31AD56513/Microvia-2005E-Final-9-06.pdf
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Source: Design recommendations HDI – HDI Design Guide - Wurth
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