"Increase spacing between pads to minimise risk from bridging
Align multi-pin components parallel to solder transport direction
As wetting is inferior, use smaller pads to ensure that no pad areas remain without solder. This will be important for equipment used in corrosive environments. “Rounding” of corners of pads helps prevent thermal decomposition of flux at higher lead-free temperatures."
More about rounded pads - IPC-7351B
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