METRIC PITCH BGA AND MICRO BGA ROUTING SOLUTIONS - Tom Hausherr
This white paper includes a Common Via Padstacks Table
'via Blog this'
Sunday, June 30, 2013
Friday, June 28, 2013
WEBENCH Export – TI.com
WEBENCH Export – TI.com:
The WEBENCH Export option will take any Power Designer design and convert it on the fly to leading CAD development platforms. Designers using the industry-leading tools from Altium, Cadence, or Mentor Graphics can immediately go from easy-to-use, expert system, value-optimized designs created online in the no-cost WEBENCH Designer or Architect platforms directly into their CAD software. WEBENCH Export users can open a design in their software just as if they spent days or weeks creating it natively.
WEBENCH Export allows the direct download of dynamic WEBENCH designs into leading CAD environments in minutes.
DFM - Thermal Reliefs Pros and Cons
Thermal reliefs added to RF connector ground pins will allow for easier hand soldering.
Here's some of the advantages of NO thermal reliefs:
http://electronics.stackexchange.com/questions/14435/why-thermal-reliefs-on-vias
Here's some of the advantages of NO thermal reliefs:
http://electronics.stackexchange.com/questions/14435/why-thermal-reliefs-on-vias
Tuesday, June 25, 2013
Monday, June 24, 2013
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