Common PCB Design Issues and Reasons for Circuit Board Failure

Common PCB Design Issues and Reasons for Circuit Board Failure:

Acid Traps

Plating Voids
Slivers
Insufficient Copper-to-Edge Clearance

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New Copper Wrap Requirements in IPC-6012D-AM1, Starting in 2018

New  Copper Wrap Requirements in IPC-6012D-AM1, Starting January 1, 2018

Criteria for class 3 copper wrap plating effective January 1, 2018 for new designs

IPC released in October 2017, IPC-6012D-AM1, Qualification and Performance Specification for Rigid Printed Boards. This amendment brought to light the new acceptance criteria for copper wrap plating on class 3 products. The IPC D-33a task group provided an effective date of January 1, 2018 for new designs using the criteria set aside in Amendment 1. Legacy designs would continue to use the criteria established in the original standard IPC-6012D from September 2015.

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The top 10 crystal oscillators! – SnapEDA Blog

The top 10 crystal oscillators! – SnapEDA Blog:

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ZESTRON - Clean PCB Experts

ACADEMY - ZESTRON Americas:

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IPC-2221B PCB Trace Spacing / Clearance by Voltage

IPC-2221B PCB Trace Spacing / Clearance by Voltage:

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Calculating Voltage Drops - Saturn PCB Toolkit

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Example:

Start by getting the Conductor's DC Resistance

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0.04445 Ohms in the above example

Select the Ohm's Law tab, Solve for Volts, enter the trace DC resistance and current.

Then select Solve.

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That's it !

Automated Test Solutions - Averna:

Automated Test Solutions - Averna:

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