PCB Crosstalk Fundamentals and Strategy

PCB Crosstalk Fundamentals and Strategy - Cisco

Electrical Equipment Insulation Applications - The Gund Company

"Insulation Component Solutions for Power Systems Equipment"

Electrical Equipment Insulation Applications - The Gund Company:

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BGA Packages - Lattice Layout Recommendations

"As Ball Grid Array (BGA) packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout techniques. This document provides a brief overview of PCB layout considerations when working with BGA packages. It outlines some of the most common problems and provides tips for avoiding them at the design stage. A key challenge of adopting fine-pitch (0.8 mm or less) BGA packages is the design of a route fanout pattern that maximizes I/O utilization while minimizing fabrication cost. This technical note provides an overview of PCB design examples provided by Lattice Semiconductor."

Source Link:

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Paste Stencil for 01005 Chips - Lead-Free

Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing 

Solder past Stencils Design Guide

Solder past Stencils Design Guide:

Solder Paste Calculator

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Printed Circuit Boards: Final Finish Options

Printed Circuit Boards: Final Finish Options like Immersion Tins, Immersion Silver, Electroless Nickel /Immersion Gold, Direct Gold Over Copper: 

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Through Hole Sizes for Leaded Parts

What should the hole size be for a leaded through hole component ?

Factors to consider include:

Max lead size.
Min Hole size.
Solder flow through the lead.

Typically the finished hole size should be 8 to 10 mils larger than the maximum lead diameter.

Example:

If the component has a round lead with a diameter of 32 mils: 

Then the finished hole diameter should be 32 + 10 = 42 mils.

Note for square and rectangular shaped leads the lead diameter needs to account for the diagonal dimension of the lead.