You may be
surprised to know that HP Test equipment has used landless vias (no annular rings) for several years.
HP’s studies
show the landless vias can be more reliable than vias with pads.
Benefits include
higher routing density (more traces per layer) which may reduce the total number
of layers required in the PCB stackup.
Every layer
pair in the stackup is approximately a 20% cost adder.
The trick
is to find the fabricator that knows the process for plating via barrels with no annular
rings.
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