Thermal Solutions

Thermal Vias – A Packaging Engineer's Best Friend

Source: Electronics Cooling

Thermal Conductivity of Metals

Aluminum (w/m K) > 200
Copper  (w/m K) > 386

Carbon Steel is a poor thermal conductor, (w/m K)  ~ 30 to 50.

For heat sinks copper and aluminum are obvious choices due to their superior thermal properties and cost. 

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EnzoTech

CNB-S1L

• Multiple push pin locations for universal mounting on various board assembly (hole to hole distance: 53mm to 59mm)
• Formed of pure copper to enhance thermal conductivity.
• Excellent surface flatness minimizes the interface between heat source and heat sink.

EnzoTech SLF-30(mm)

Digi-Key

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TTM's Thermal Management Solutions

TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.

Source:  TTM's Thermal Management Solutions

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