Thermal Vias – A Packaging Engineer's Best Friend
Source: Electronics Cooling
Thermal Conductivity of Metals
Aluminum (w/m K) > 200
Copper (w/m K) > 386
For heat sinks copper and aluminum are obvious choices due to their superior thermal properties and cost.
EnzoTech
CNB-S1L
- Multiple push pin locations for universal mounting on various board assembly (hole to hole distance: 53mm to 59mm)
- Formed of pure copper to enhance thermal conductivity.
- Excellent surface flatness minimizes the interface between heat source and heat sink.
TTM's Thermal Management Solutions
TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.
Source: TTM's Thermal Management Solutions
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