Rounded PADs for Lead Free (RoHS)

Solder &  PCB Issues for Lead Free (RoHS)

"Increase spacing between pads to minimise risk from bridging

Align multi-pin components parallel to solder transport direction

As wetting is inferior, use smaller pads to ensure that no pad areas remain without solder. This will be important for equipment used in corrosive environments. “Rounding” of corners of pads helps prevent thermal decomposition of flux at higher lead-free temperatures."

More about rounded pads - IPC-7351B

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