Ultra-fine pitch devices pose new PCB design issues | Embedded

Ultra-fine pitch devices pose new PCB design issues | Embedded: 

"Ultra-fine pitch devices pose new PCB design issues Syed W. Ali, Nexlogic Technologies, Inc. SEPTEMBER 10, 2012

No Industry Specifications/Design Guidelines As indicated earlier, the electronics industry hasn’t yet developed the specifications nor the expertise to effectively perform 0.3mm ultra-fine pitch design and layout. 

This leaves many PCB layout engineers with few options other than to base their 0.3mm ultra-fine pitch on conventional 0.5mm pitch IPC design guidelines and layout rules."

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